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- "Intra-pulse Beam Steering for High Density Interconnect via Drilling"
- Flex PCB via drilling industry standard
- Nanosecond UV Nd:YAG laser
- Tertiary positioning at up to 1,000 mm/s
- Highest throughput and via quality
- esiFlex™ nanosecond UV laser
- Advanced tertiary positioning at up to 10,000 mm/s
- High precision and high-speed HDI PCB & IC package manufacturing
- AcceleDrill™: Drill multiple via diameters in a single pass
- HyperSonix™: Ablate copper and material with minimal pulses
- Economincal flex-pcb system with Precision Pulse™ power control
- Nanosecond UV laser
- Stage and galvo positioning at up to 500 mm/s
- Verify quality and ensure accurate MLCC specifications
- Tests the smallest part sizes ranging from 0201-0603 (0603-1608 metric)
- Productivity rates of up to 1.2 million chips per hour
- Verify quality and ensure accurate MLCC specifications
- Tests larger part sizes ranging from 0603-1210 (1608-3225 metric)
- Productivity rates of up to one million chips per hour
- High-density loading of MLCC components
- Uniform positioning of chips for accurate termination bandwidth
- Compatible with automatic or manual loading machines
- High precision and high-speed FCBGA ABF IC substrate manufacturing
- AcceleDrill™: Drill multiple via diameters in a single pass
- HyperSonix™: Ablate copper and material with minimal pulses
- Shortest pulse widths with high reliability
- Femtosecond green fiber laser
- Beam positioning up to 750 mm/s for drilling and up to 1000 mm/s for routing
- Maximize performance for high-volume chip processing
- Broad selection of sizes and types of replacement tooling
- Custom designs are also available
- Economincal flex-pcb system with broad capabilities
- Nanosecond UV laser
- Stage and galvo positioning at up to 500 mm/s
- Ultra-light dancer design avoids web wrinkle
- Move and replace the handler without realignment
- Extract maximum performance from your ESI flex-PCB system
