geode-a-abf-via-drilling-system

Geode A CO2 Via Drilling System For FCBGA (ABF) IC Substrates

Specifications

Technical Specs

Average Power
>250 W
Peak Power
100 W
Panel Processing
Dual-head two panel system
Panel Size Range
16x20 in. to 22.05x24.5 in.
Panel Height Detection
Touchdown sensor (calibrated to align with camera focus), Z-Mapping
Part Thickness Range
50 to 3000 um
Energy Monitoring
Real time pulse energy & monitoring (programmable alarm settings)
Automation Accuracy
(panel to chuck): 500 um

Processing
LDD Conformal Mask
Scan Area
12 x 6 mm
Load / Unload Automation
Standard, Standard with NG Function, Panel Flipper with NG Function
Total System Accuracy
<7um |M| + 4σ
Via Diameter Range
30 to 85 um
Laser Pulse Frequency
200 kHz (No rep rate)

Average Power
>250 W
Peak Power
100 W
Panel Processing
Dual-head two panel system
Panel Size Range
16x20 in. to 22.05x24.5 in.
Panel Height Detection
Touchdown sensor (calibrated to align with camera focus), Z-Mapping
Part Thickness Range
50 to 3000 um
Energy Monitoring
Real time pulse energy & monitoring (programmable alarm settings)
Automation Accuracy
(panel to chuck): 500 um

Processing
LDD Conformal Mask
Scan Area
12 x 6 mm
Load / Unload Automation
Standard, Standard with NG Function, Panel Flipper with NG Function
Total System Accuracy
<7um |M| + 4σ
Via Diameter Range
30 to 85 um
Laser Pulse Frequency
200 kHz (No rep rate)

Resources & Downloads

Literature

ESI Laser Drill Systems(5.8 MB, PDF)

Data Sheets

Geode A Data Sheet(601.5 kB, PDF)

Application Notes

Videos

Inside Making a Via with Geode™: RTPC Edition(2:39)
Intra-pulse Beam Steering for High Density Interconnect via Drilling(18:18)
Geode A Demo Reel(3:10)
Geode A Footprint Benefits(2:10)